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PCB Technology
序 |
Project | Single, double-sided. | Multilayer (4-10) |
---|---|---|---|
1 | Base material | FR-4,F4B,Tp,Rogers,Arlon,Taconic | FR-4,F4B,Rogers+FR-4 |
2 | Copper thickness | 0.018-2OZ | 0.5-3 OZ |
3 | Substrate thickness | 0.127-10MM | 0.4-6.0MM |
4 | Minimum pore size | 0.25MM thickness-diameter ratio (6:1) | 0.25MM thickness-diameter ratio (6:1) |
5 | Minimum linewidth/spacing | 0.1MM/0.1MM | 0.1MM/0.1MM |
6 | Hole position tolerance | 0.075MM | 0.075MM |
7 | PTH aperture tolerance | 0.075MM | 0.075MM |
8 | NPTH Aperture Tolerance | 0.05MM | 0.05MM |
9 | Exterior dimension tolerance | 0.15MM | 0.15MM |
10 | Testing insulation resistance | >30MΩ | >30MΩ |
11 | Test voltage | 250V Max | 250V Max |
12 | Surface treatment | OSP, lead-sprayed tin, lead-free tin, tin, gold, silver, gold finger | OSP, lead-sprayed tin, lead-free tin, tin, gold, silver, gold finger |
13 | Solder resist color |
Green oil, blue oil, red oil, butter, white oil, black oil |
Green oil, blue oil, red oil, butter, white oil, black oil |
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